We have a complete production line, and strict quality inspection process
· The machine is used to detect defects such as whether the BGA is correctly welded or tinned
· Pass the test of defective products after the furnace
· Semiconductor products use high lead solder for mold attachment materials in various devices
High quality chip packaging and testing is our manufacturing attitude, and high quality factories are responsible for every customer
Factory Information
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Factory Size
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1,000-3,000 square meters
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Factory Country/Region
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3 / F, Building 2, Building 215, Henan Xin Cun, Songyuanxia Community, Guanhu Street,
Longhua District, Shenzhen City, Guangdong Province
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No. of Production Lines
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8
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Contract Manufacturing
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OEM Service Offered, Design Service Offered, Buyer Label Offered
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Annual Output Value
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Above US$100 Million
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